UNIQUE AUTOMATION LIMITED
UNIQUE AUTOMATION LIMITED Our main products : Wave solder, Reflow oven, PCB loader unloader, PCB conveyor, Laser makring machine, Solder paste printer, and other SMT euiqpment.
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PLC PC 10 Zones SMT Reflow Oven Machine Lead Free Assembly Line
Lead Free Reflow Oven, Assembly Line 10 Zones SMT Reflow Machine
Features
1. Heating mode is "upper circulating hot air + lower infrared hot air". It is equipped with three forced cooling zones.
2. Upper heating adopts microcirculation heating method, which can achieve large heat-air exchange and has very high heat exchange rate. It can reduce the setting temperature in the temperature zone and protect the heating elements. It is particularly suitable for lead-free welding.
3. Microcirculation heating mode, vertical air blowing and vertical air collecting can solve the problem of dead angle when using guide rail in reflow soldering.
Product Specification of Reflow Oven
| Modle | RF-H800I |
| Temp Accuracy | ± 1C |
| Temp Deviation | ± 2C |
| Weight (kg) | Approx.2100 |
| Cooling Type | Forced-air Coooling |
| Control | PLC + PC |
| Power Supply | 3P/AC 380V OR 3P/AC 220V |
| Parts Height | On Baoard 35mm / Under Board 20mm |
| Temp Range | Room Temperature ~ 320C |
| Mesh Belt Width ( mm ) | 460 ( or Customized ) |
| Heating Zone Length (mm) | 2932 |
| Options Available | 450/500 max PCB width Central support for big PCB Extra cooling zone |
| Cooling Zone length ( mm ) | 600 |
| Conveyor Type | Chain and Mesh Belt |
| Temp Accuracy | ± 1C |
| Running / Starting Power (kw) | 8.5 / 33 |
| Machine Dimension (mm) | 5150*1490*1510 |
| PCB Width (mm) | 50 - 400 ( or customized ) |
| Conveyor Speed (mm/min ) | 20-1500 |
Soddle Profile
The componnetn is brought to a temperature of at least 240C for soldering. Using a saddle profile the board is gradually heated in line with pre-defined, individual temperature ranges. Even components with differing thermal masses are heated homogeneously and temperature differences mimimised.
Linear profile:
With a linear profile, the component is not heated in a stepped manner during soldering, in fact it is heated along anidentical linear temperature gradient. Linear profiles can reduce cycle times andcan help to reduce soldering errors suchas tombstoning.
The Pictures Showing of Reflow Oven